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Intel IoT Roadshow

JIn order to encourage innovation and the maker spirit to design the prototypes of various Internet of Things (IoT) devices, Intel IoT Roadshow took place for the second year at Ching Long Business Club in Taipei, stimulating makers’ imagination to realize their creativity for different IoT applications.

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Caption 1: In order to encourage innovation and the maker spirit, the 2016 Intel® IoT Roadshow took place on April 30 and May 1 in Taipei. More than two hundred people in Taiwan and from abroad took part in the competition, during which they had sharing with Intel and its partners, engaged in discussion, developed their creativity to use Intel® IoT Developer Kit and Intel® Edison Development Board to design the prototypes of various IoT devices that are compact and energy efficient.

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Caption 2&3: The 2016 Intel® IoT Roadshow is provided to Brazil, India, Italy, Holland, Mainland China, Mexico, Russia, the UK, and the US in addition to Taiwan. In Taiwan, each of the first 100 people arriving at the event received free Intel® IoT Developer Kit to help stimulate makers’ imagination to realize their creativity for different IoT application

 

Caption 4: On May 1, the 2016 Intel® IoT Roadshow announced its winners, including one first-place winner, two second-place winners, and three third-place winners, who were awarded with US$1,500, US$1,000, and US$500, as well as prizes. They were also invited to Maker Faire Taipei 2016 on May 7 and 8 to share their works with makers in Taiwan and from abroad.

Caption 4: On May 1, the 2016 Intel® IoT Roadshow announced its winners, including one first-place winner, two second-place winners, and three third-place winners, who were awarded with US$1,500, US$1,000, and US$500, as well as prizes. They were also invited to Maker Faire Taipei 2016 on May 7 and 8 to share their works with makers in Taiwan and from abroad.

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Cation 5&6: The first-place entry at the 2016 Intel® IoT Roadshow was Dillow created by – from the left – Chen Hongming (student at the Department of Electrical Engineering, National Taiwan University of Science and Technology), Huang Zhuxuan (graduate from the Department of Industrial and Commercial Design, National Taiwan University of Science and Technology), Wang Jingxuan (student at the Department of Electrical Engineering, National Taiwan University of Science and Technology), and Yu Boyi (student at the Department of Electrical Engineering, National Taiwan University of Science and Technology). Based on daily life experience, Dillow keeps a record of sleep quality and words uttered during sleep for cerebrum analysis to carefully examine the pressure or emotional responses in daily life to make conclusion of behavioral patterns.


Caption 7: The second-place entry at the 2016 Intel® IoT Roadshow was Jammin Hub created by Carlos Argueta (right) from Honduras and Arnaud Dellinger (left) from France. Based on Intel® Edison Development Board, Jammin Hub enables smart devices at home to sense different emotions of dwellers to accordingly adjust lighting, temperature, types of music to be played, community content push, Uber calling, etc. Carlos Argueta and Arnaud Dellinger also won at the 2015 Intel® IoT Roadshow, and their participation and win this year indicate Intel’s increasing influence in the maker community.

Caption 7: The second-place entry at the 2016 Intel® IoT Roadshow was Jammin Hub created by Carlos Argueta (right) from Honduras and Arnaud Dellinger (left) from France. Based on Intel® Edison Development Board, Jammin Hub enables smart devices at home to sense different emotions of dwellers to accordingly adjust lighting, temperature, types of music to be played, community content push, Uber calling, etc. Carlos Argueta and Arnaud Dellinger also won at the 2015 Intel® IoT Roadshow, and their participation and win this year indicate Intel’s increasing influence in the maker community.


Caption 8: Many industry experts were invited to the 2016 Intel® IoT Roadshow to serve on the judge panel scoring entries based on degrees of innovation and to which extent Intel® IoT Developer Kit is used, including cloud connectivity, sensor use frequency, overall development kit use frequency, etc. The judges from the right are: Dr. Richard Chung, IoT Solutions Architect, Intel Rachel Liu, Education & Innovation Program, Corporate Affairs, Intel Y.T. Lee, Vice President, QNAP Systems Li Fang Tseng, Senior Director, Mobile Communications Business Group, MiTAC International

Caption 8: Many industry experts were invited to the 2016 Intel® IoT Roadshow to serve on the judge panel scoring entries based on degrees of innovation and to which extent Intel® IoT Developer Kit is used, including cloud connectivity, sensor use frequency, overall development kit use frequency, etc. The judges from the right are:
Dr. Richard Chung, IoT Solutions Architect, Intel Rachel Liu, Education & Innovation Program, Corporate Affairs, Intel Y.T. Lee, Vice President, QNAP Systems Li Fang Tseng, Senior Director, Mobile Communications Business Group, MiTAC International

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